An Analysis of Anisotropic Etching Process

Etching toward Depth Direction

Abstract

Micro machineries such as micro sensor & switch are produced by utilizing an anisotropic etching process, however, its chemical mechanism or etching process is not yet clarified. The present paper has analyzed the process for a variety of substrate (wafer) orientation & mask patterns and predicted the finished profile by the help of reactive cage effect. The new theory has been confirmed quantitatively comparing the analysis with the experimental etching rates.