Journal of the Japan Society of Powder and Powder Metallurgy
Online ISSN : 1880-9014
Print ISSN : 0532-8799
ISSN-L : 0532-8799
Paper
Low temperature brazing characteristics and mechanical properties of Ag-Cu-Sn alloys
Taisuke HigashiMakoto InoueTakamasa OnokiMasaru YokotaYasunori MurataAtsushi Nakahira
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JOURNAL OPEN ACCESS

2009 Volume 56 Issue 11 Pages 661-667

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Abstract
This study focuses on Ag-Cu-Sn ternary alloys used as brazing filler metals. These alloys are known to have a high wettability and a low melting temperature. However, the alloys become brittle by the addition of large amounts of Sn. In this study, we investigated the brazing characteristics and the mechanical properties of Ag-Cu-Sn ternary alloys that contain Sn in the range of 15 to 30 wt.% Sn, which have not been reported until now. 47.5 wt.% Ag-25.5 wt.% Cu-27.0 wt.% Sn alloy was compatible ratio with low melting temperature and high wettability. However the alloy was very brittle because of the existence of Cu3Sn. This material is known as hard and brittle intermetallic compounds. We added Ni to the alloy to improve the brittleness. 1 wt.% Ni addition improved its rupture strain significantly. It is suggested that the good mechanical properties are derived from production of (Cu, Ni)3Sn intermetallic compounds and grain coarsening.
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© 2009 by Japan Society of Powder and Powder Metallurgy

本論文はCC BY-NC-NDライセンスによって許諾されています.ライセンスの内容を知りたい方は,https://creativecommons.org/licenses/by-nc-nd/4.0/deed.jaでご確認ください.
https://creativecommons.org/licenses/by-nc-nd/4.0/deed.ja
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