Abstract
Some kinds of dielectric ceramic powder were encapsulated in stainless steel(SUS 304) mold with a dimensions of 22(O.D.) - 10(I.D.) x 30h mm. The mold containing ceramic powder was preheated at 1000°- 1300°C for 8 minutes, and press-forged rapidly under uniaxtial compressive load. By comparing some microstructural features between the forged products and the normally sintered ones, it was clarified that the hot-forge processing may be promising for the densification of some dielectric ceramics powder.
