Fabrication and Thermal Properties of Polyimide/Cu Functionally Graded Material

Mamoru Omori; Akira Okubo; Toshio Hirai

doi:10.2497/jjspm.45.216

著者情報

キーワード: thermoplastic polyimide, functionally graded material, spark plasma system, thermal conductivity, residual stress, thermal expansion mismatch

ジャーナルオープンアクセス

1998 年 45 巻 3 号 p. 216-219

DOI https://doi.org/10.2497/jjspm.45.216

詳細

抄録

Thermal conductive composites were formed from thermoplastic polyimide and A1N powders, and functionally graded materials (FGMs) were fabricated from those composites and Cu powder using a spark plasma system. A high pressure of 245 MPa was required to obtain dense composites whose thermal conductivity was more than 10 W/m.K. The thermal conductivity of FGMs prepared at 39.2 and 245 MPa was 35 and 60 W/m.K.

責任著者(Corresponding author)

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