Abstract
In 1980, multilayer chip inductors were developed by thick film and co-firing technologies using low temperature sintered NiCuZn ferrites and Ag. The NiCuZn ferrites have been known as the only ones that can be sintered below the melting point of Ag, and have been used as the material of multilayer ferrite chip components. Since NiCuZn ferrites have a large magnetostriction, these ferrites are comparatively sensitive against stress, and therefore magnetic properties are easily deteriorated or changed by the stress. In this study, therefore, MgCuZn ferrites are chosen as a useful material for the multilayer ferrite chip components, because the magnetostriction (λ ?? ) of these ferrites is normally less than that of NiCuZn ferrites. MgCuZn ferrites, however, is generally sintered over 1000°C, so the investigations to sinter MgCuZn ferrites at the low temperature were performed.
