2002 年 49 巻 7 号 p. 615-619
Cluster-assembling is superior in nano-scale-structure control, where we have to make clusters regular in size to draw out the size-dependent characteristics. Using a plasma-gas-condensation type cluster deposition apparatus, we have succeeded in preparing monodispersed transition metal clusters with the mean sizes d=5 to 15nm. We carried out measurement of a transmission electron microscopy and electrical resistivity for clusters randomly deposited on a substrate. The cluster assembling process is interpreted in terms of the percolation theory. The critical percolation thickness, tc, increases with increasing d, while the critical coverage rate estimated from tc is 0.63, being independent of d. tc also increases with increasing the substrate temperature owing to the surface migration of clusters on the substrate. The electrical resistivity and transmission electron microscope image demonstrate the cluster-cluster coalescence above 500K.