Abstract
Thermal characterization of isotropic electrically conductive adhesives (ICAs) is required for thermal management, because the ICAs are applied to die bonding for IC or LED chips. We have been developed steady state comparative-longitudinal heat flow method using cartridge type specimens for thermal conductivity measurement. In present paper, applicable thickness of the specimen and uncertainty of the measurement under effective thermal conductivity of 0.2～50W/m·K of the ICAs were investigated. The results demonstrated that this measurement method could measure the thermal conductivity of specimen within 10% uncertainty under 0.2~70mm thickness range. The effective thermal conductivity of the silver-epoxy conductive adhesive was affected by temperature and an interfacial thermal contact resistance between the adhesive and its adherend.
