抄録
This paper discusses the reliability assessment of advanced structures such as micro/nano structures, electronics packaging for modern electronic devices, high temperature structures such as nuclear power plants, rocket engines for space application. Characterization of advanced materials includes free-standing electrodeposited nano-crystalline nickel thin film, polysilicon, and piezoelectric thin film for MEMS/nano structures. Lead-free solders under pseudo-power cyclic thermal loading, impact loading and mechanical bending loading were evaluated for reliability assessment of the advanced electronic packaging. Reliability assessment of Cu/SnAg double bump structures was performed for the 150µm pitch flip chip electronic packaging application. The 316L austenitic stainless steel for high-temperature components application such as in the primary side of liquid metal cooled fast breeder reactor (LMFBR) was tested under various temperatures where dynamic strain ageing occurs. The effects of dynamic strain ageing on the tensile behavior and fatigue behavior of 316L stainless steel have been identified.
