Potential Applications of Flexible Electrostatic Adhesive Devices for Material Handling

—Double-layer Electrode and Micro-embossed Contact Surface Structure to Improve Adhesive Force—

Abstract

The improvement of flexible electrostatic adhesive device (FEAD) that effectively improves the adhesive force on cardboard was verified experimentally, to realize the grasping operation of cardboard boxes used in logistics. By improving the double-layer electrode and the micro-embossed structure of the adhesive surface, the adhesive force was three times higher than that of the previously developed FEAD, it succeeded in lifting a cardboard box weighing 4[kg]. Therefore, the possibility of grasping a cardboard box weighing 10[kg] was confirmed by increasing the electrode area by a factor of 2.5. The experimental results showed the potential application of FEDA for material handling.