Abstract
For the ELV directive in EU, the Sn-Cu lead-free solder alloy is used in automotive electronic components. In the future, these are made high-temperature operation by the next-generation semiconductor devices. Therefore, the further improvement of the reliability is required in the Sn-Cu lead-free solder alloy. In this paper, tensile-tests were carried out using the Sn-Cu-Ni lead-free solder alloy. The result was used for consideration about the high-temperature deformation mechanism. As for the Sn-Cu-Ni lead-free solder alloy, the stress exponent becomes >3. This result shows that the deformation mechanism is the dislocation creep.
