The 61st JSAP Spring Meeting 2014
Session ID : 18p-E14-1
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 61
Location : [in Japanese]
Date : March 17, 2014 - March 20, 2014
Strain Distributions at Edge of Corner in Bonded Si in Chip-On-Wafer Structures
*Noriyuki Taoka, Osamu Nakatsuka, Mizushima Yoriko, Hideki kitada, Kim Young Suk, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima
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