JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 75th JSAP Autumn Meeting 2014
Session ID : 18a-A18-3
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Investigation of Etching Process of III-V Layer toward III-V/SOI Hybrid Devices by using Plasma Activated Bonding
*Junichi SuzukiYusuke HayashiYuki KunoJoonHyun KangTomohiro AmemiyaNobuhiko NishiyamaShigehisa Arai
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Keywords: 18a-A18-3
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© 2014 The Japan Society of Applied Physics
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