JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 62nd JSAP Spring Meeting 2015
Session ID : 14a-B2-14
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Application of Phonon Engineering to Electronics Packaging
*Tomoyuki HatakeyamaMasaru Ishizuka
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Keywords: 14a-B2-14
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© 2015 The Japan Society of Applied Physics
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