The 63rd JSAP Spring Meeting 2016
Session ID : 21p-P16-9
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 63
Location : [in Japanese]
Date : March 19, 2016 - March 22, 2016
Study of Heterogeneous Bonding of InP Chip on Si Substrate with Polymer Intermediate Layer
Keywords:
21p-P16-9,
heterogeneous integration
Details
Article 1st page
