JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 64th JSAP Spring Meeting 2017
Session ID : 14p-P8-10
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Thermal Management Method for Chip-Scale Package Light-Emitting Diodes During Reliability Tests
*Byungjin MaEung Suk ParkHae Hyung LeeKwanhun Lee
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© 2017 The Japan Society of Applied Physics
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