The 64th JSAP Spring Meeting 2017
Session ID : 16a-421-11
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 64
Location : [in Japanese]
Date : March 14, 2017 - March 17, 2017
Fabrication of 1.5um GaInAsP LD on InP/Si Substrate using Hydrophilic Wafer Bonding Technique
*Gandhi Kallarasan, Tetsuo Nishiyama, Naoki Kamada, Yuya Onuki, Kazuhiko Shimomura
Author information
Keywords:
16a-421-11,
Optics and Photonics English Session,
semiconductor optical devices,
semiconductor lasers,
optoelectronics
Details
Article 1st page
