The 65th JSAP Spring Meeting 2018
Session ID : 17p-P10-90
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 65
Location : [in Japanese]
Date : March 17, 2018 - March 20, 2018
Effect of material selection on bonding interface for integrating epitaxial spintronic devices by Three-dimensional (3D) integration technology
*Jiamin CHEN, Yuya Sakuraba, Kay Yakushiji, Hideki Takagi, Yuuichi Kurashima, Naoya Watanabe, Katsuya Kikuchi, Shinji Yuasa, Kazuhiro Hono
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