The 66th JSAP Spring Meeting 2019
Session ID : 10a-PA5-27
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 66
Location : [in Japanese]
Date : March 09, 2019 - March 12, 2019
Development of La214 materials for conductive buffer layers of REBCO coated conductors
*Takanori Motoki, Michito Ishimori, Ayumu Matsuno, Shin-ichi Nakamura, Toshiya Doi, Jun-ichi Shimoyama
Author information
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