The 66th JSAP Spring Meeting 2019
Session ID : 11a-PA1-2
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 66
Location : [in Japanese]
Date : March 09, 2019 - March 12, 2019
Development of Low Damage Light-induced Assembling with Submillimeter-bubble-mimetic Substrate
*Kota Hayashi, Yasuyuki Yamamoto, Karuna Ohashi, Mamoru Tamura, Shiho Tokonami, Takuya Iida
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