The 80th JSAP Autumn Meeting 2019
Session ID : 20a-E215-2
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Autumn Meeting
Number : 80
Location : [in Japanese]
Date : September 18, 2019 - September 21, 2019
Investigation of bonding strength between (InP, Si)/SiO2 and Si by Surface Activated Bonding based on Fast Atom Beam assisted by Si nano-film
Keywords:
20a-E215-2,
JSAP-OSA Joint Symposia 2019,
Photonics Devices, Photonic Integrated Circuit and Silicon Photonics,
Silicon photonics,
surface activated bonding
Details
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