The 80th JSAP Autumn Meeting 2019
Session ID : 19p-C207-7
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Autumn Meeting
Number : 80
Location : [in Japanese]
Date : September 18, 2019 - September 21, 2019
Development of superconducting through-silicon vias (TSVs) for scalable superconducting qubits
Details
Article 1st page
