JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 80th JSAP Autumn Meeting 2019
Session ID : 19a-PB2-38
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Flip-chip bonding superconducting connections for scalable superconducting quantum annealing machines
*Kazumasa MakiseMutsuo HidakaHiroshi NakagawaKatsuya KikuchiGo FujiiMasahiro UkibeShiro Kawabata
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Keywords: 19a-PB2-38, Flip chip
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© 2019 The Japan Society of Applied Physics
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