JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 81st JSAP Autumn Meeting 2020
Session ID : 8a-Z20-10
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Height measurement of solder bumps using parallel-phase shifting digital holography with a set of two-close wavelengths
*Hiroyuki IshigakiIkuo FutamuraTakahiro MamiyaYoshio Hayasaki
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© 2020 The Japan Society of Applied Physics
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