JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 68th JSAP Spring Meeting 2021
Session ID : 17a-Z20-3
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Development of high-Tc superconducting THz emitters using wafer bonding techniques
*Takanari KashiwagiJeonghyuk KimShungo NakagawaMayu NakayamaTakuya YamaguchiTakashi MatsumaeYuuichi KurashimaEiji HigurashiHideki TakagiTatsuya MoriGenki KuwanoShinji KusunoseKanae NagayamaTakuya YuharaYuuma SaitoShouhei SuzukiManabu TsujimotoHidetoshi MinamiKazuo Kadowaki
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© 2021 The Japan Society of Applied Physics
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