JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 68th JSAP Spring Meeting 2021
Session ID : 16a-P01-11
Conference information

Host: The Japan Society of Applied Physics

Name : JSAP Spring Meeting

Number : 68

Location : [in Japanese]

Date : March 16, 2021 - March 19, 2021

Influence of the Conductive Adhesive in the Electrode Joining of the Electronic Device
*Mana Koike, Masaki Yoshida, Kota Oishi, Koji Tamada
Author information
Keywords: 16a-P01-11, Conductive Adhesive
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (310K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2021 The Japan Society of Applied Physics
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top