The 82nd JSAP Autumn Meeting 2021
Session ID : 10p-N405-10
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Autumn Meeting
Number : 82
Location : [in Japanese]
Date : September 10, 2021 - September 23, 2021
Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration
*Hiromu Onodera, Kikuchi Takehiko, Ohiso Yoshitaka, Amemiya Tomohiro, Nishiyama Nobuhiko
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