Preparation and thermoelectric properties of peltier cooling modules by printing processes

Abstract

Thick films of Bi₂Te₃ system thermoelectric materials were prepared by printing processes, and thermoelectric cooling modules were also prepared using the n- and p-type films. Seebeck coefficients and electric conductivities of the films increased up to sintering temperatures of 470-500°C, and showed the maximum values at the temperatures. The values of thermoelectric properties decreased over 470-500°C, which are related with microcrucks and reduction of the amount of Te in the films. The maximum values of the Seebeck coefficients of the films were similar to those of the corresponding bulk elements. The electrical conductivities of the films, however, were lower than the bulk elements. The microcrucks in the films caused the reduction of the conductivities. The thermoelectric properties of the modules corresponded with those of the n- and p-type thick films.