Abstract
The first report described the cutting force, specific energy, and depth of cut for a single grain found during ductile-mode grinding of BK7 glass. To achieve a more intermittent machining process, the application of thrust force directional vibration was demonstrated. Here, a single-crystal silicon wafer (1,0,0) surface was ground with and without thrust force directional vibration-assisted grinding. The normal grinding force of grinding with vibration showed a comparatively low value, but was quite stable. The removal rate was about 3 times that without vibration. Further, in a fly-cut experiment, single-crystal Si could be cut in ductile mode using a single cutting edge with vibration. The removal process by successive cutting edges was determined by the cutting conditions including vibration. The results of this study suggested that a multi-cutting tool with uniform cutting space is required to achieve more effective ductile-mode machining with thrust force directional vibration.
