Abstract
This study was performed to clarify the friction and wear phenomena important in abrasive machining with atomic-scale material removal, such as polishing of magnetic disk substrates and CMP of semiconductor substrates. Here, various phenomena in the region from sliding to atomic removal on a well-defined copper workpiece surface by an extremely fine rigid diamond abrasive were analyzed using a molecular dynamics model in which an abrasive grain is connected to a three-dimensional apring and holding rigidity of the abrasive grain is taken into account. A series of simulations under several indentation depth conditions clarified that the one- or two-dimensional atomic-scale stick-slip phenomenon in proportion to the period of atomic arrays of workpiece surface occurs in sliding processes withouto atomic removal. On the other hand, it was also demonstrated that the period and amplitude of stick-slip phenomenon vary when accompanied with atomic removal due to the increase in normal load. These are specific phenomena in such abrasive machining processes at the atomic-scale.
