Abstract
The dicing processing is one method for cutting hard and brittle materials, which is used for cutting thin plates, such as silicon wafers. Ultrasonic vibration dicing was studied to improve the processing accuracy or diced edge chipping. As this ultrasonic dicing technique requires resonance of the dicing tool, it is necessary to use a specialized ultrasonic tool. Therefore, this study was performed to develop a new ultrasonic vibration dicing tool using the normal commercially available dicing blades. This newly developed ultrasonic tool is expected to reduce costs. This report describes the vibration characteristics of this tool.
