Abstract
The diamond wire tools are the slicing tool fixed diamond grains on the core wire by nickel plating or resin bonding. Diamond wire tools are used to slice hard and brittle materials, such as sapphire wafers for light-emitting diodes or silicon wafers for solar cells. In this study, a flow plating method was designed using a slurry of diamond grains to improve the manufacturing speed of diamond wire tools. The diamond grains fixed on the core wire by nickel plating or resin bonding. The possibility of high-speed manufacturing of diamond wire tools was examined using a prototype plating system. In addition, the relations between plating conditions and slicing characteristics of diamond wire tools and the mechanism of high-speed manufacturing of diamond wire tools were examined.
