Immediately after dressing, the surface of a conventional resin-bonded diamond_wheel has several statuses. Especially, surface roughness deterioration occurs due to the decreace in the strength of abrasive bond. Before grinding, preprocessing is therefore performed using dummy materials to remove these abrasives, but the shape of the wheel may change. Therefore, we developed a repair method using laser energy for the gripping strength of grain using thermoplastic resin. The surface roughness was improved by more than 21.1%, and the repair effect was confirmed.

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Ultrasonic diamond grinding uses an ultrasonic oscillation effect for die steel face grinding. Smooth and glossy surfaces can be obtained successfully with little abrasive wear. The mirror finishing technique requires cutting edge truncation because the cutting edge shape of the tool affects the ground surface resulting from transcription of the cutting edge. This paper describes effect of the cutting edge truncation of an electroplated diamond tool used in ultrasonically assisted grinding. The truncated tool produced a flat ground surface with roughness of 0.13μmRz. The injection mold composed of freeform surfaces mimicking the key sheet of a cellular phone was finished using truncated electrodeposited diamond tools with a spherical shape.

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The blasting process has recently been applied to microprocessing. However, control of the process is difficult because a method for monitoring of erosion rate has not been developed. In this study, we investigated light emission during the process to develop a monitoring method. First, the emission spectra were measured. The measurements indicated that the emissions are derived from fracture of abrasives or fracture of the workpiece. Second, the intensity of emission was measured. The results indicated that light emission, which is derived from fracture of the workpiece, can be used to monitor erosion rate. In addition, emission derived from fracture of abrasives may be useful for monitoring the amount of fractured abrasives.

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The diamond wire tools are the slicing tool fixed diamond grains on the core wire by nickel plating or resin bonding. Diamond wire tools are used to slice hard and brittle materials, such as sapphire wafers for light-emitting diodes or silicon wafers for solar cells. In this study, a flow plating method was designed using a slurry of diamond grains to improve the manufacturing speed of diamond wire tools. The diamond grains fixed on the core wire by nickel plating or resin bonding. The possibility of high-speed manufacturing of diamond wire tools was examined using a prototype plating system. In addition, the relations between plating conditions and slicing characteristics of diamond wire tools and the mechanism of high-speed manufacturing of diamond wire tools were examined.

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