Abstract
Precision slicing tests were performed for single-crystal silicon using a newly developed dicing wire saw system and diamond wires. The developed dicing wire saw enabled the slicing of thick workpieces composed of hard and brittle materials, which could not be sliced by conventional dicing machines. To achieve high precision and efficiency, the dicing wire saw system used tension control and high speed control technologies, which provide a maximum wire feeding speed of 2000 m/min. In this study, the diamond wire was driven in a single direction at a speed of 750 - 1750 m/min and the slicing force, wire wear, and workpiece surface roughness after slicing were investigated experimentally. The results showed that as a new slicing system, the developed dicing wire saw was useable for high-precision slicing of thick workpieces.
