Abstract
In semiconductor equipment and medical equipment industries, there is a requirement for a technique to accurately and efficiently process fine holes <1 mm in diameter in brittle materials, such as glass. Generally, hard and brittle materials, such as glass, are difficult to cut. However, there are many requirements for practical applications by cutting. To respond to these demands, an ultrasound-assisted method was applied to drill 0.3-mm holes, and the tool behavior and cutting resistance immediately after tool contact were evaluated. The results indicated that the spiral-shaped cutting force disappeared at contact with the drill when using ultrasonic drilling, and the hole positioning accuracy was improved compared to conventional drilling.
