Examination using Three-Dimensional Thermal Conductivity - Thermal Stress Analysis for Prevention of Galvanizing Cracks during Hot Dip Galvanizing of Steel Structures

Abstract

Steel structures may suffer cracks during hot dip galvanizing due to abrupt changes in temperature. Steel structures with draining holes to be galvanized are prepared. Then, authors measure what stresses are generated around those holes when galvanizing the steel structure. Moreover, authors presume thermal stresses arising in steel members during its hot dipping process by the coupled analysis of thermal conductivity and thermal stresses to compare with actually measured values. From the analysis result of four different scallop-added steel structures, proper structural details of scallops to avoid galvanizing cracks are decided.