Transient Thermal Stresses in a Half Plane with a Crack Parallel to the Surface
1986 年 29 巻 248 号 p. 343-347
詳細
1986 年 29 巻 248 号 p. 343-347
Transient thermal stresses in a half plane with a crack parallel to the surface are investigated. It is assumed that the half plane is initially at uniform temperature, and subjected to stepwise temperature rise on the surface. The problem is formulated as integral equations. From their numerical solutions, variations of the stress intensity factors with time are obtained.
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