2002 Volume 45 Issue 2 Pages 282-289
In the printed wiring board manufacturing sector, methods have been developed to improve the circuit packaging density. The multi-layer printed wiring board manufacturing process is receiving particular attention. In the current manufacture of these boards, the method frequently used is to laminate the core with insulating resin, namely a build-up process. Etching is generally used to form the holes connecting the circuits of these boards. However, a problem has emerged in that the strength of the substrate decreases due to the insulating resin part as the multi-layers are progressively formed. Thus, it becomes necessary to use FRP for the insulation layer part. Since it is very difficult to etch composites, lasers have been proposed for a new way to drill holes in such materials. By appropriate adjustment of the laser penetration energy, the holes are drilled only in the insulation part, and a technique is proposed to stop the holes using the copper foil forming the circuit. AFRP has been considered a suitable FRP for such laser processing. In the present study, attempts were made to experimentally produce multi-layer boards using AFRP and GFRP for the build-up insulation layer, and the characteristics of blind via holes drilling with a small power laser were investigated.
JSME international journal. Ser. 1, Solid mechanics, strength of materials
JSME international journal. Ser. A, Mechanics and material engineering
JSME international journal. Ser. 3, Vibration, control engineering, engineering for industry
JSME international journal. Ser. C, Dynamics, control, robotics, design and manufacturing