抄録
The distributions of stress induced by an applied stress σ0 in five joint plate specimens (copper/silicon nitride) with different thicknesses were calculated using three-dimensional (3-D) FEM stress analysis and the results were compared with those obtained using two-dimensional (2-D) FEM stress analysis. Along the longitudinal center line perpendicular to the interface on the surface of the specimen, the 3-D FEM calculation predicted a maximum stress of approximately 1. 36σ0 in the interfacial region in the silicon nitride, with a minimum stress of 0.9σ0 appearing in the copper. On the other hand, the 2-D FEM predicted only slight change in the stress in the interfacial region, giving a value close to the applied stress σ0. The maximum stress decreased more rapidly with decreasing thickness of the specimen, and the stress value agreed more closely with the value calculated by the 2-D FEM as the distance from the interface increased.
