ASMP : proceedings of Asian Symposium on Materials and Processing
Online ISSN : 2424-2853
セッションID: F-10
会議情報
F-10 EFFECT OF TEMPERATURE ON THE WARPAGE BEHAVIOR OF A MULTI-LAYERED THIN-CORE FLEXIBLE SUBSTRATE(Session: Composites II)
Jonee P. ZuflegaJr Amorsolo
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会議録・要旨集 フリー

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抄録
A thin-core flexible substrate made of a multi-layered composite of metal and polymer components was subjected to different temperature conditions and analyzed for its warpage behavior. The warpage behavior was carefully measured at different intervals up to the peak temperature. Two warpage mechanisms were observed and the mechanical properties of the individual layers of the substrate were found to contribute to these varying behaviors.
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© 2006 一般社団法人 日本機械学会
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