抄録
The microstructure and growth of intermetallic compounds(IMCs) of Sn-3.0%Ag-0.5%Cu solder on substrate between Cu/NiAu and Cu were investigated after aging at 150 C for various times. In case Cu/NiAu substrate, the interface IMCs layer was (CuNi)_6Sn_5. For Cu substrate, the IMCs layer was Cu_6Sn_5. During aging at 150 C, the thickness of (CuNi)_6Sn_5 layer grew gradually but the thickness of Cu_6Sn_5 layer grew rapidly at beginning and both seem to reach a certain value. The mean thickness of IMCs at interface was quite lower for Cu/NiAu substrate.
