C-9 WIRING TECHNOLOGY USING SILVER NANOPASTE^(R) BY MEANS OF INK-JET PRINTING AND LASER SINTERING FOR MICROFABRICATION(Session: Forming II)

Abstract

In this work, the feasibility of minute wiring by means of-ink jet printing with Ag NanoPaste^(R) and its laser sintering is investigated. Laser sintering twice in a row by scanning a pulsed Nd:YAG laser beam of 1.06μm wavelength and 0.1 mm spot diameter at average laser powers of 1.99 W and 4.45 W in air is most favorable. The Ag nano particles with around 5 nm in diameter stabilized by dispersant and organic solvent are melted to form coarse agglomerates of about 1μm on the Cu substrate. The agglomerates were identified as Ag, while a slight peak of Cu was observed, which means that solid phase diffusion occurs at the interface.