H-10 EFFECT OF AGING TEMPERATURE ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0% Ag-0.5%Cu and Sn-3.8%Ag-1.0%Cu SOLDERS AND Cu SUBSTRATE(Session: Welding / Joining)
Released on J-STAGE: June 19, 2017 |
2006
H-10
J. Khamwannah, M. Phadungkietjaroen, V. Sengkan, O. Diewwanit