C-9 WIRING TECHNOLOGY USING SILVER NANOPASTE^(R) BY MEANS OF INK-JET PRINTING AND LASER SINTERING FOR MICROFABRICATION(Session: Forming II)

Katsuhiro Maekawa; Mamoru Mita; Hirokazu Saito; Kazuhiko Yamasaki; Yorishige Matsuba; Nobuto Terada; Hitoshi Saito

doi:10.1299/jsmeasmp.2006.56

セッションID: C-9

DOI https://doi.org/10.1299/jsmeasmp.2006.56

会議情報

C-9 WIRING TECHNOLOGY USING SILVER NANOPASTE^(R) BY MEANS OF INK-JET PRINTING AND LASER SINTERING FOR MICROFABRICATION(Session: Forming II)

Katsuhiro Maekawa, Mamoru Mita, Hirokazu Saito, Kazuhiko Yamasaki, Yorishige Matsuba, Nobuto Terada, Hitoshi Saito

著者情報

会議録・要旨集フリー

詳細

抄録

In this work, the feasibility of minute wiring by means of-ink jet printing with Ag NanoPaste^(R) and its laser sintering is investigated. Laser sintering twice in a row by scanning a pulsed Nd:YAG laser beam of 1.06μm wavelength and 0.1 mm spot diameter at average laser powers of 1.99 W and 4.45 W in air is most favorable. The Ag nano particles with around 5 nm in diameter stabilized by dispersant and organic solvent are melted to form coarse agglomerates of about 1μm on the Cu substrate. The agglomerates were identified as Ag, while a slight peak of Cu was observed, which means that solid phase diffusion occurs at the interface.

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