抄録
A high-precise measurement method using a digital image correlation method combined with a fine adjustment stage is proposed for the purpose of the thermal deformation measurement of small parts like the electronic devices. An object mounted on the fine adjustment stage is made to move parallel to the in-plane of the object surface at the displacement magnitude of the sub-micron and the images of the object surface are taken by a CCD camera. Calibration curves of the horizontal or vertical displacement vs. transfer pixel of the every pixel point of image are made by using the obtained images. In the case of disregarding out-of-plane deformation, it is possible to carry out the high-precise in-plane displacement distribution measurement using the calibration curves. As an application, the deformation of a driving electronic package is measured using this system.
