Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
Online ISSN : 2424-2837
セッションID: OS02W0433
会議情報
OS02W0433 Nondestructive testing of bonding integrity between tiles and wall using sonic-shearography
Michael Y.Y. HungH. M. Shang
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会議録・要旨集 フリー

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A main effort in the maintenance of high-rise buildings is to inspect external walls for tile separation. This paper reports a novel optical method known as sonic-shearography for detecting and assessing bonding integrity between the tiles and the external wall of buildings. The inspection process is non-contact and full-field, and it allows the size, shape and location of debonds to be determined. Being quantitative in nature, this technique enhances the efficacy of maintenance strategies for early prevention against falling tiles.
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© 2003 一般社団法人 日本機械学会
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