抄録
Micromachined films are proposed as mechanical clips to clamp optic fibres and other electrical components in optical packages. This paper reports mechanical test structures used to evaluate the properties of new materials for these MEMS and MST applications. A micromechanical beam 100μm wide and 400μm long is scanned with a stylus profilometer which deflects the beam, and the mechanical properties are deduced from the deflection characteristics. For example, prototype structures in 5μm thick silicon carbide film on a silicon substrate are produced by (a) laser cutting a track in the SiC film, (b) undercutting the SiC by anisotropic silicon etching using KOH in water, and (c) trimming if necessary with the focused laser system or with a focused ion beam. This approach has the advantages of fast design turn around and proof of concept, and it is practical to apply it to a wide range of materials. From the stylus profilometer data the Youngs modulus for chemical vapour deposited silicon carbide is 360 +/-50 GPa indicating that it is a promising material for packaging applications.
