抄録
This paper describes the tensile, low cycle fatigue, creep and creep-fatigue standard testing methods for solders recommended by the solder strength subcommittee in JSMS. These methods recommended material preparation, specimen geometry, testing method and data acquisition. Benchmark experiments were carried out based on the standards and they demonstrated that the methods are available for stable data generation. Tensile and low cycle fatigue database for Sn-37Pb and Sn-3.5Ag were published as the solder database.
