Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
Online ISSN : 2424-2837
セッションID: OS10W0188
会議情報
OS10W0188 Plasticity-creep separate method for viscoplastic deformation of lead-free solders
Ken-ichi OhguchiKatsuhiko Sasaki
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会議録・要旨集 フリー

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抄録
In this paper, a viscoplastic constitutive model was proposed considering both the determination method of the material constants and the implementation method for a general purpose FEM program. The model was incorporated into FEM code "ANSYS" and its applicability to the lead-free solder alloys was verified by the simulations of the viscoplastic deformation. As a result, the proposed model was successfully incorporated into "ANSYS", and then it could accurately describe the creep and cyclic loading of three lead-free solder alloys using the material constants determined from only the pure tensile tests.
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© 2003 一般社団法人 日本機械学会
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