The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
Online ISSN : 2424-2837
2003
Conference information
OS6(3)-10(OS06W0409) Characterization of Thin Films for MEMS Optical and Electrical Device Packaging Applications
David F. Moore, Johnny H. He, P. Boyle, Matt A. Hopcroft
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 112-

Details
Download PDF (77K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2003 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Predecessor

Proceedings of the Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics

Share this page
feedback
 Top