OS6(3)-10(OS06W0409) Characterization of Thin Films for MEMS Optical and Electrical Device Packaging Applications

Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics

Online ISSN : 2424-2837

2003

DOI https://doi.org/10.1299/jsmeatem.2003.112

会議情報

OS6(3)-10(OS06W0409) Characterization of Thin Films for MEMS Optical and Electrical Device Packaging Applications

David F. Moore, Johnny H. He, P. Boyle, Matt A. Hopcroft

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会議録・要旨集フリー

p. 112-

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© 2003 The Japan Society of Mechanical Engineers

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Proceedings of the Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics

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